Module Engineer for Assembly Department

Job Details:

Job Description: 

The Role and Impact As a Module Engineer, you will be at the forefront of managing and optimizing high-volume manufacturing equipment and processes critical to the production of cutting-edge integrated circuits. You will conduct precise tests, implement improvements, and collaborate on technology transfers to ensure manufacturing excellence while meeting safety, quality, and cost goals. Your contributions will directly drive device miniaturization and process innovations that shape Intel's global manufacturing capabilities. Business Group Intel Corporation's Assembly Engineering group is a dynamic team focused on accelerating semiconductor manufacturing processes and technology development. The group plays an instrumental role in advancing high-volume production, fostering innovation, and enabling global technology transfers. By joining this team, you'll contribute to Intel's mission of creating world-changing technology that improves lives everywhere. Key Responsibilities - Manage critical high-volume manufacturing equipment and processes to support device miniaturization and integrated circuit production. - Conduct tests and measurements to ensure control over critical dimensions and defectivity within the production line. - Recommend and implement modifications to optimize production techniques and enhance manufacturing efficiencies. - Execute maintenance and repair activities for equipment and relevant module components. - Drive continuous improvement initiatives focused on safety, quality, cost, productivity, defects, and yield. - Collaborate with equipment suppliers to resolve technical issues and implement key improvements. - Develop and optimize systems for excursion prevention and discrepancy detection in materials and processes. - Participate in technology transfer and audit activities to ensure aligned standards across global manufacturing sites. - Lead equipment installation, conversion, and qualification during factory ramps, ensuring safety and quality standards are met.

Qualifications:

- Bachelor's degree or Master's degree in Mechanical Engineering, Mechatronics, Automation Control, Electronics, Data Science, Materials Science & Engineering, Metallurgy, Chemical Engineering or a related physical science/engineering discipline.

- Minimum 1–3 years of experience in semiconductor packaging, electronics manufacturing, or high-volume Surface Mount Technology (SMT) assembly environments.

- Proficient in both spoken and written English communication.

- Working knowledge of BGA package assembly and SMT manufacturing processes.

- Experience in yield improvement, quality engineering, and manufacturing problem-solving.

- Knowledge of BGA package assembly and SMT manufacturing processes.

- Knowledge of FMEA, PFMEA, Control Plans, SPC, and corrective/preventive action methodologies.

- Knowledge of data analysis tools, scripting and programing such as JMP,  SQL, Power BI, Python.

- Strong troubleshooting, analytical, and root-cause investigation skills.

- Ability to work effectively across multiple engineering disciplines and manufacturing organizations.

Additional preferred qualifications include:

- Experience supporting automated inspection systems and vision-based manufacturing equipment.

- Familiarity with quality methodologies such as Six Sigma, DMAIC, 8D, FMEA, and Statistical Process Control.

- Experience driving yield improvement projects in semiconductor or electronics manufacturing.

You bring relevant experience in one or more of the following areas:

- Hands-on experience with AutoCAD, Solidworks, with the ability to produce designs for fabrication.

- Hands-on experience sustaining automated optical inspection, visual inspection, or automated manufacturing equipment.

- Hands-on experience sustaining, programming, and troubleshooting -automated stencil printing systems, 3D Solder Paste Inspection (SPI), multizone reflow ovens, and aqueous/chemical deflux cleaning modules.

- Process Metallurgy & Joint Reliability: Working knowledge of BGA package assembly, lead-free solder metallurgy (SAC alloys, low-temperature Bismuth), intermetallic compound (IMC) growth control, and package warpage due to Coefficient of Thermal Expansion (CTE) mismatch.

- Hands-on experience with industrial imaging hardware, High-Precision 2D/3D Metrology.

- Proven experience with successful projects with main task of developing automation script and app that improve manufacturing processes (including process optimization, add-in detection capabilities using image processing / ML / AI).

 
Join us to be part of shaping the future of technology with impactful contributions to global manufacturing operations. Your journey with us will foster innovation, collaboration, and personal growth.

          

Job Type:

Experienced Hire

Shift:

Shift 1 (Vietnam)

Primary Location: 

Vietnam, Ho_Chi_Minh_City

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

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