AirJet PAK is a self-contained, plug-and-play solid-state active cooling module that combines multiple AirJet chips and drive circuitry for thermal management in compact edge-AI systems.
AirJet PAK is Frore Systems’ integrated solid-state cooling module for compact edge-computing systems. It combines multiple AirJet chips with drive circuitry and is designed to mount directly on system-on-modules, including NVIDIA Jetson, Qualcomm, and AMD platforms. Frore describes autonomous operation, vibration-free cooling, and designs suited to dustproof and water-resistant enclosures. The original PAK family includes 1C, 3C, and 5C configurations; the 5C is described as supporting up to 100 TOPS and removing up to 34 watts of heat. A separate PAK 5C-G2 variant is also documented.
AirJet Mini G2 solid-state cooling chips are integrated into the AirJet PAK 5C-G2 variant; this is implementation evidence for that variant, not confirmation of the chip configuration in the original PAK family.
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