What We're Looking For:

We're looking for photonics packaging engineers to contribute to, and own aspects of the A-0 and A-1 packages. 

This role bridges the classically divided photonics and advanced packaging skillsets, and thus is an unique point in our team.

 

Ideal Background:

• Experience with integrated photonics package assemblies with multiple dies 
• Experience with integrated circuit MCM assemblies with multiple heterogeneous materials, including compound semiconductors
• Understanding of photonics concepts, such as mode field diameters, mode mismatch, polarization, etc. 

 

Nice to Have:

• Experience with large device count photonic assemblies 
• Experience with clear underfill
• Experience with high density fiber attach
• Experience with large substrate size photonic MCM assemblies 
• Hands-on experience with PIC design