Change the world. Love your job. 
We are seeking a highly motivated Advanced GaN Process Development Engineer to join our Plasma Etch Process Development team. This role is responsible for developing, optimizing, and transferring advanced plasma etch processes supporting next-generation GaN semiconductor technologies. The engineer will work closely with integration, equipment, metrology, and manufacturing teams to drive technology innovation, improve process capability, and enable successful product ramp into high-volume manufacturing.

The ideal candidate possesses strong technical expertise in plasma etch fundamentals, semiconductor process development, statistical data analysis, and cross-functional problem solving.

The responsibilities of a Manufacturing Development Process Engineer in this role include:

• Process Development

  • Develop and optimize plasma etch processes for advanced semiconductor devices.
  • Design and execute experiments (DOE) to improve critical process metrics, including:
    • Etch rate
    • Selectivity
    • Critical dimension (CD) control
    • Profile control
    • Defectivity
    • Uniformity
  • Characterize process performance and establish process windows for manufacturing robustness.
  • Evaluate new process chemistries, hardware configurations, and chamber technologies.

  Technology Introduction

  • Support development and qualification of next-generation etch technologies.
  • Collaborate with device integration teams to meet product and technology requirements.
  • Drive process readiness for technology transfers from development into manufacturing.
  • Establish process specifications, control plans, and release documentation.

  Tool and Equipment Engineering

  • Partner with equipment engineering teams to improve tool capability, productivity, and reliability.
  • Lead chamber matching, equipment qualification, and process performance improvement activities.
  • Support installation and startup of new etch platforms.

  Data Analysis & Continuous Improvement

  • Analyze complex process datasets using statistical methods and data analytics tools.
  • Identify root causes of process excursions and implement corrective actions.
  • Lead yield improvement and defect reduction initiatives.
  • Utilize SPC methodologies to monitor and improve process stability.

  Cross-Functional Collaboration

  • Work closely with:
    • Process Integration
    • Manufacturing
    • Yield Engineering
    • Metrology
    • Equipment Engineering
    • Quality and Reliability teams
  • Present technical findings and recommendations to management and key stakeholders.
  • Mentor junior engineers and technicians as needed.

Minimum requirements:

• 5+ years of semiconductor plasma/dry etch process development experience.
• Bachelors in an engineering, science, or related STEM discipline
• Strong foundation in statistical process control, engineering change control and process release strategies
• Experience with DOE methodologies and statistical analysis.
• Familiarity with metrology techniques including SEM, CD-SEM, ellipsometry and defect inspection tools.

Preferred qualifications:

• Experience in Gallium Nitride (GaN) and/or similar wide-bandgap III-V nitrides processes and technology development 
• Strong foundation in statistical process control, engineering change control and process release strategies
• Proficiency with Python, Claude, or other AI models or tools is a plus
• Demonstrated strong analytical and problem solving skills resulting in innovative and creative process solutions
• Experience with process development and transfer on etch platforms (LAM, AMAT, TEL, etc)
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different job functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for result