TM-Firmware Engineer(Local)-Shenzhen
Shenzhen · Posted 3MO AGO
工作职责:
1. 负责空调产品单板软硬件设计开发;
2.负责市场及生产问题的处理和解决;
3.上级主管交付的其他工作。
职位要求:
1.本科及以上学历,电气、电子、计算机、自动控制及相关专业;
2.有电子产品单板软、硬件开发经验;
3. 熟练掌握单片机或DSP相关开发环境,熟练掌握C ,C++ 汇编语言编程;
4. 熟悉CAN, RS485,ETHERNET, PLC;
5.能独立思考和解决问题,勤奋认真,善于团队合作。
6.英语四级以上
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