What We’re Looking For:

 

We’re looking for engineers to contribute to the thermomechanical, electrical and mechanical design and assembly of the IO modules that attach to our A-0 and A-1 wafers.  

 

Ideal Background:

• Deep understanding and hands-on experience with signal integrity signoff for copper and electro-optic connector interfaces 
• Hands-on experience with mechanical aspects of electrical and electro-optic connectors 
• Experience with bringup of connectorized links and systems

 

Nice to Have:

• Experience and understanding of sockets and socketed connectors
• Experience with co-packaged copper and co-packaged optics
• Experience with high density optical modules 
• Experience with XPO optical pluggable form factors