Example Company
Software engineer
- Location
- San Francisco
- Type
- Full time
- Compensation
- $150k-$200k
- Posted
- 2 days ago
Join a team building useful software. Work closely with engineering and design to turn new ideas into products.
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PIC Process Integration Engineer
- Type
- Full time
- Posted
- 8D AGO
About the role
The Photonic Integrated Circuit (PIC) group at Nokia is at the forefront of developing and producing the chips that power our terabit-scale digital optical transport networks. We’re looking for a driven and collaborative Process Integration / Fab Start-Up engineer to join our PIC Product Integration Team.
We are seeking a highly motivated and technically skilled engineer to lead the bring-up and qualification of a new Indium Phosphide (InP) photonics semiconductor fabrication facility. This role is critical to establishing high-yield, scalable, and reliable photonic device manufacturing processes in a cutting-edge fab environment. The ideal candidate will have experience with InP or compound semiconductor process development, fab tool qualification, and yield improvement.
- BS/MS/PhD in Electrical Engineering, Materials Science, or related field.
- Hands-on experience in compound semiconductor fabrication, with a strong preference for InP-based photonics.
- Understanding of semiconductor process integration, yield improvement methodologies, and cleanroom practices.
- Experience with fab tool bring-up and qualification, including troubleshooting and maintenance support.
- Strong problem-solving skills, with a data-driven mindset and familiarity with tools like JMP, Python and MES/SPC software packages.
- Experience with SPC, Design for Manufacturing (DfM), and six-sigma principles for continuous improvement is a plus.
- Excellent communication and teamwork skills; able to work in a fast-paced startup or ramp-up environment.
•Fab Bring-Up & Equipment Qualification: Support the start-up and drive the qualification of front-end and back-end process tools for InP-based photonic device fabrication. Work closely with process engineers and other internal stakeholders to meet process and equipment milestones.
Process Development & Integration: Develop and optimize process modules (etch, deposition, lithography, diffusion, metallization, etc.) for InP-based PICs (Photonic Integrated Circuits). Ensure process robustness and repeatability across the full device flow.
Yield & Reliability Engineering: Establish process monitoring metrics, inline metrology strategies, and SPC to drive yield improvement. Identify root causes of process excursions or device failures; lead corrective actions using FA tools and DOE methodology.
Cross-Functional Collaboration: Interface with device design, test, and packaging teams to ensure manufacturability and alignment on performance targets.
Documentation & Technology Transfer: Develop and maintain detailed process documentation, FMEA analyses, and qualification reports. Support the transfer of developed processes from R&D to pilot and volume production.
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