Position Overview
We are seeking a highly skilled and experienced Optical System Design Lead to
spearhead the development of optical coupling and packaging solutions for advanced
photonic devices. The ideal candidate will have a deep understanding of optical system
design, coupling techniques, and packaging methodologies. This role requires a
combination of technical expertise, leadership ability, and innovative thinking to drive
product design and implementation from concept to manufacturing.

Key Responsibilities
● Optical System Design:
○ Lead the design and development of optical coupling systems, including
fiber-to-chip and free-space coupling techniques.
○ Optimize optical interfaces for performance, reliability, and
manufacturability.
● Packaging Development:
○ Design advanced photonic packaging solutions with a primary focus on
ensuring optical stability.

○ Collaborate with cross-functional teams to integrate optical components
into compact and scalable designs.

● Prototyping and Testing:
○ Develop prototypes for optical coupling and packaging designs.
○ Oversee testing and validation to meet performance metrics, including
insertion loss, alignment tolerance, and durability.

● Collaboration and Leadership:
○ Work closely with mechanical, electrical, and manufacturing engineers to
ensure seamless integration of optical subsystems.
○ Mentor and guide a team of optical engineers, fostering a culture of
innovation and excellence.
● Documentation and Compliance:
○ Generate detailed technical documentation and design guidelines.
○ Ensure compliance with industry standards and regulations for optical
systems and packaging.

Required Skills & Experience:
Qualifications
Education and Experience:
● Master’s or Ph.D. in Optical Engineering, Photonics, Physics, or a related field.
● 7+ years of experience in optical system design, coupling, and packaging,
preferably in photonics or a related industry.
Technical Skills:
● Proficiency in optical simulation tools (e.g., Zemax).
● Expertise in optical alignment and coupling techniques (e.g., active/passive
alignment, precision bonding).
● Knowledge of photonic integrated circuits (PICs) and their packaging challenges.
● Familiarity with advanced manufacturing techniques (e.g., laser welding, epoxy
bonding, and hermetic sealing).