What We’re Looking For:

We’re looking for ASIC design engineers to contribute to and own blocks in the development of the A-0 and A-1 wafer products, across both the XPU, memory chiplet and other dies on the wafer. 

 

Ideal Background:

An ideal candidate will have: 

• Hands-on experience with multiple advanced node tapeouts
• Ownership of ASIC design portion of at least one block in multiple advanced node tapeouts
• Understanding of PPA improvement and what levers exist for each level of the stack 
• Ability to think creatively about methodology for fast design iterations 

 

Nice to Have:

• Hands-on experience with ASIC design process for large die (ideally reticle max) chips 
• Hands-on experience with ASIC design process for AI chips 
• Hands-on experience with multi-die/multi-chiplet/MCM designs