Example Company
Software engineer
- Location
- San Francisco
- Type
- Full time
- Compensation
- $150k-$200k
- Posted
- 2 days ago
Join a team building useful software. Work closely with engineering and design to turn new ideas into products.
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Silicon Photonics Packaging Engineer Co-op
- Type
- Full time
- Posted
- 13D AGO
About the role
Number of Positions: 2
Duration: 4 months
Date: January 2027-June 2027
Location: Onsite in Sunnyvale, CA,
Education Recommendations
Current M.S. or Ph.D. student in electrical engineering, physics, applied physics, or other similar fields with an accredited university in the USA.
- Experience with package and process design/development from design to production.
- Knowledge of design for manufacturing, 2.5D/3D packaging, and TSVs.
- Experience with documentation of fabrication, inspection, and assembly processes.
- Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
It would be nice if you also had:
- Understanding of optical epoxies, non-hermetic packaging, and high-volume packaging and thermal analysis of 2.5/ 3D packages.
- Experience in the semiconductor chip and wafer-level back-end processing, assembly, and/or packaging.
- Experience in high-speed electronics package design and/or laser package design.
- Experience with thermo-mechanical simulations using ANSYS or similar software.
- Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging.
- Familiarity with design and simulations of optical packaging using free space optics or fiber coupling.
We are searching for a Silicon Photonics Packaging Co-op for our Spring 2027 Term to engage in the research and development of silicon photonics transceiver modules.
- Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.
- Design optical transceiver packages in collaboration with cross-functional teams and stakeholders to ensure package requirements are met.
- Own Design Rules documents and ensure Design for Manufacturing specifications are met.
- Perform mechanical integrity and thermal simulations, tolerance analyses and characterization.
- Drive package debug activities during product validation and qualification.
- Plan and Drive prototype assembly builds to enable deliveries for early design validation.
- Apply in-depth knowledge of advanced packaging principles and stay current with new technological advancements.
