Product Development Engineer (28nm)

Join the Revolution in Semiconductor Manufacturing at LFAB!

We're at the forefront of an exciting era of growth and innovation at LFAB (Lehi Fab), where our state-of-the-art 300mm, 65nm, 45nm and 28nm analog and embedded wafer manufacturing facilities are driving production of a diverse semiconductor portfolio in the heart of the Silicon Slopes. As we continue to expand we're seeking an experienced Product Development Engineer with expertise in 28nm or equivalent advanced node technologies to drive our new technology ramp. At full production, our wafer fabs will manufacture tens of millions of analog and embedded processing chips every day and power electronics everywhere, supporting customer demand for decades to come. We're committed to responsible, sustainable manufacturing and making a meaningful impact on the local community through job creation and substantial investments in K-12 STEM education. In this role, you will be part of the factory team that will lead the activities ramp of our latest 28nm technology to yield entitlement, helping shape the future of the semiconductor industry.

Responsibilities include:

• Yield Optimization: Conduct thorough analysis of production yield issues to identify root causes and implement corrective actions that enhance product performance and manufacturing efficiency.
• New Product Launch: Collaborate with Business Units to characterize, qualify, and successfully release new products to production, ensuring a smooth transition from design to manufacturing.
• Production Support: Address daily production challenges including low yield disposition and process troubleshooting.
• Continuous Improvement: Lead initiatives focused on productivity, cost reduction, and quality enhancement across the production process.
• Data-Driven Insights: Utilize statistical tools and production data to guide engineering decisions and process improvements.
• Design Collaboration: Work with design teams on product simulation, design verification and silicon debug. 
• Cross-functional Collaboration: Liaise with business units' product engineering teams to drive yield improvements through test program optimization, hardware enhancements, and setup adjustments.

Minimum requirements:

• Experience with 28nm (or similar) technologies
• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field
• 5+ years of experience in semiconductor manufacturing, test engineering, failure analysis, or related areas
• Strong technical background in semiconductor devices, testing, or failure analysis principles
• Experience analyzing production test data and diagnostic results to investigate device failures
• Proficiency in tools such as JMP, Excel, and statistical analysis software.
• Excellent communication and collaboration skills.
• Ability to work independently and in cross-functional teams.

 

Preferred qualifications:

• Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or related field
• 10+ years of experience in semiconductor manufacturing, testing, failure analysis, or yield engineering
• Experience with memory mapping tools, ATPG diagnostics with Cadence Modus or Synopsys Tetramax , and Avalon layout database environments
• Experience using electrical failure analysis techniques such as photon emission analysis, laser-assisted fault isolation, waveform acquisition, or similar FA instrumentation
• Experience analyzing wafer-level yield or semiconductor process development issues
• Experience with digital IC design, mixed-signal IC design, or related design environments
• Expertise in analog/mixed-signal circuit design, analysis, and verification, including experience with Operational Amplifiers (OP Amps), Analog-to-Digital Converters (ADCs), Digital-to-Analog Converters (DACs), and Radio Frequency (RF) circuits
• Experience with digital logic design and verification, including Automatic Test Pattern Generation (ATPG) and scan chain design and implementation
• Knowledge of memory design and architecture, including Static Random-Access Memory (SRAM) and Flash memory

• In-depth knowledge of semiconductor manufacturing processes, including fabrication, assembly, and test

   

• Proven ability to drive results, prioritize tasks, and manage time to meet project deadlines
• Adaptability and resilience in a fast-paced, dynamic environment with multiple priorities and interruptions
• Strong interpersonal and influencing skills, with ability to build effective relationships and communicate with diverse stakeholders

• Exceptional problem-solving skills, with attention to detail and ability to think creatively

   

• Strategic thinking and ability to navigate complex, high-pressure situations with poise and professionalism